General PCB Capabilities	HLC	HDI	FPC&Rigid-Flex	IMS PCB
Layer Count	1-24	4-16	FPC:1-6  Rigid-Flex:2-12	1-2
Board Thickness(mm)	0.3-3.4	0.27-3.2	FPC:0.05-1.0   Rigid-Flex：0.27-3.2	1.6 (63) - Typical                 3.2 (126) - Max.                     0.8 (32) - Min.
Min.Dielectric Thickness(mm)	0.045	0.03	0.05	0.05
Max.Panel Size(mm×mm)	724 (28.5") x 622 (24.5")	610 (24")×475（18.7"）	FPC: 250 (9.2") x 1500(59.1")                  Rigid: 545(21.5")×622(24.5")	520(20.5") x 610 (24.0")
Base Copper Thickness(oz)	1/3-6	1/3-4	FPC:1/3-2  Rigid-Flex:1/3-4	/
Hole-wall Copper Thickness(µm)	20-70	20/18,  25/20	20/25	20/25
Outer Layer Finished Copper Thickness(oz)	1-5	1-2	1-2	1-2
Laminate Supplier	Rogers，Panasonic，Nelco，TUC，Isola，ITEQ，SYTECH，Nanya，Taconic、EMC、DOOSAN、Wazam、CCTC，NOUYA		SYTECH，TAIFLEX，ThinFlex	Wazam，Ventec，ITEQ，SYTECH，RISHO
Laminate Type	CME-1, CEM-3, High-CTI，Unleaded（Mid、High-Tg），Halogen Free，High frequency（hydrocarbon、PTFE），High Speed（mid. loss、low loss、very low loss，ultra low loss）, PI, LCP			Copper Base，Aluminum Base
Min.line width/space (inner layer)(mm)	0.05/0.05	0.05/0.05	FPC:0.04/0.04  Rigid-Flex:0.05/0.05	/
Min.line width/space (outer layer)(mm)	0.05/0.05	0.05/0.05	FPC:0.04/0.04  Rigid-Flex:0.05/0.05	0.10/0.10
Line width tolerance(mm)	+/-20%(Typical)                       +/-10%(Advanced)	+/-20%(Typical)                       +/-10%(Advanced)	+/-20%(Typical)                       +/-10%(Advanced)	+/-20%(Typical)                       +/-10%(Advanced)
Layer to layer registration(mil)	5	5	5	5
Impedance(%)	8	8	8	/
Mechanical drill diameter(mm)	≥0.15	≥0.15	≥0.15	1-6
Laser hole diameter(mm)	≥0.075	≥0.075	≥0.075	/
Max.Aspect ratio (PTH)	14:1	14:1	14:1	4:1
Max.Aspect ratio (Microvia)	/	1:1	1:1	/
Backdrill depth tolerance(mil)	±3	±3	±3	±4
Max.Warpage(%)	0.50	0.50	0.50	0.50
Signal Integrity	SET2DIL/Delta-L/VNA			/
Surface Finish	HASL-LF，HASL，Electroless Nickel/Immersion Gold，Immersion Tin，OSP，Immersion Silver，Gold Finger，Selective OSP			HASL-LF，Electroless Nickel/Immersion Gold，OSP
Structure	Through hole	5+N+5 Anylayer	Common Symmetrical structure，Symmetrical structure HDI	/
			Air-gap Structure
			Asymmetric structure，HDI
Special Product
Embedded PCB	Embedded parallel capacitor、Embedded daughter board			/
Step PCB	PTH slot，NPTH slot，Step G/F., ect.			/
Heat dissipation PCB	IMS，Embedded Cu，Embedded Coin、Embedded Ceramic、Conductive Adhesive、High Thermal Dissipation Material ., ect.			/
High density PCB	1mm pitch BGA with backdrill (2 tracks)，8mil PTH with backdrill (D+6mil)，0.35mm pitch BGA HDI., ect.			/
Other Special Process	POFV(VIPPO ), Hybrid, Partial Hybrid, Variable Length G/F, Stepped G/F, Segmented G/F, Edge Plating, N+N, Partial Plating，Semi-flex., ect.